On April 8th, we were informed by the China National Intellectual Property Administration that our new patent titled “Method of Authentication of a 3D Structure” had been granted. All 13 claims of our application were accepted by the examiner. This is an indication that the patent is considered particularly innovative compared to the existing authentication solutions, which is no easy feat considering the intensity of R&D in this field, particularly in China. Indeed, this innovative security solution, marketed under the “smart embossing®” trademark is detectable by smartphone, includes both overt and covert features, and can be produced at very low cost with every standard printing hardware and consumables.

 

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